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Microelectronics 2017

Sessions/Tracks

Conference Series LLC invites all the participants from all over the world to attend  “International Conference on Microelectronics during July 10 - 11, 2017 in Berlin, Germany which includes prompt keynote presentations, Oral talks, Poster presentations and Exhibitions

Track 1: Switching Transients in Devices and Circuits

Transformer switching is the most frequently performed operation in any power delivery system. Most of the times, this operation can be done without any undesirable consequences. However, given the right combination of system parameters, switching can result in a violent interaction between circuit breaker and transformer.

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Related Microelectronic Conferences of Switching Transients in Devices and Circuits

7th Euro Biosensors & Bioelectronics Conference , July 10-12, 2017 ,Germany;30th International Conference on Microelectronics Test Structures, March 28-30, 2017, France; Tomsk IEEE Chapter & Student Branch of the Institute of Electrical and Electronics Engineers (IEEE), June 29–30, 2017, Kazakhstan; 3rd Global Optometrist Meeting and Trade Fair on Laser Technology, September 11-13, 2017, France; 19th International Conference on Electrical and Microelectronics Systems, March 9 - 10, 2017, USA; 19th International Conference on Microelectronics and Nano electronics, March 29 - 30, 2017, Singapore; 19th International Conference on Microelectronics, Nano electronics and Nano engineering, March 23-24, 2017, Czech Republic; The 2nd International Conference on Micro-electronics Engineering (ICME 2017), March 17-18, 2017, USA; International Conference on Laser Ablation, 3-8 September, 2017, France; ISPSD - The 29th International Symposium on Power Semiconductor Devices and ICs, May 28 - June 1, 2017, Japan; European Microelectronics and Packing Conference and Exhibition in Warsaw, September 10 - 13, 2017, Mazowieckie; CES - Consumer Electronics Show, Jan 5-8, 2017, USA; Radio Wireless Week, Jan 15-18, 2017, USA; INTERNEPCON JAPAN, Jan 18-20, 2017, Japan; SPIE Photonics West, Jan 28-Feb 2, 2017, USA; Design Con, Jan 31-Feb 2, 2017, USA; Pan Pacific Microelectronics, Feb 6-9, 2017, USA.

Track 2: CMOS(Complementary metal–oxide–semiconductor)Technologies

The technology used for making integrated circuits is CMOS (Complementary metal–oxide–semiconductor) and broadly used in Random Access Memory (RAM), microprocessors, microcontrollers and other digital logic circuits. This technology is also used for several analog circuits like data converters, image sensors(CMOS sensor) , and highly integrated transceivers for several types of communication and it is the first integrated circuits hitting the markets in the seventies had a few 100 transistors integrated in bipolar technology.  Although the principles were well known, MOS arrived in the markets several years later and also it is one of the reason behind this was the inherent instability of the MOS transistors due to the existence of alkali elements in the gate dielectric and caused the threshold voltage of the transistor to shift during the operation.

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Related Microelectronic Conferences of CMOS(Complementary metal–oxide–semiconductor)Technologies

7th Euro Biosensors & Bioelectronics Conference, July 10-12, 2017,Germany; Medical Design & Manufacturing, Feb 7-9, 2017, USA; Semicon Korea, Feb 8-10, 2017, Korea; APEX IPC Expo, Feb 14-16, 2017, USA; Design & Manufacturing New England, Mar 3-4, 2017, USA; Del Mar Electronics Show, May 3-4, 2017, USA; IEEE Aerospace Conference, March 4-11, 2017, USA; BiTS - Burn-in & Test Socket Workshop, Mar 5-8, 2017, USA; IMAPS Device Packaging, Mar 6-9, 2017, USA; Satellite, Mar 6-9, 2017, USA; Smart Systems Integration, March 8-9, 2017, Germany; Embedded World, Mar 14-16, 2017, Germany; Semicon China, Mar 14-16, 2017, China; CPCA Show, Mar 14-16, 2017, China; CeBIT, Mar 20-24, 2017, Germany; GoMAC Tech, March 20-23, 2017, USA; Amper, Mar 21-24, 2017, Czech Republic; OFC - Optical Fiber Communications, Mar 21-23, 2017, USA; Microwave & RF, Mar 22-23, 2017, France; APEC Power Electronics, Mar 26-30, 2017, USA; DATE - Design Automation & Test, Mar 27-31, 2017, Switzerland. EMV, Mar 28-29, 2017, Germany; D2P Atlanta Design 2 Part, March 30-31, 2017, USA; FineTech FPD Mfgr Technology, Apr 5-7, 2017,Japan. Electronical Manufacturing Korea, Apr 5-7, 2017, Korea.

Track 3: Silicon Bipolar Technologies

A large number of innovations and developments were required to convert the original concept into an applied technology for fabricating VLSI circuits. Among these, diffusion was an significant first step, since it allowed thin bases and emitters to be fabricated by diffusing impurities from the vapour phase.

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Related Microelectronic Conferences of Silicon Bipolar Technologies

7th Euro Biosensors & Bioelectronics Conference , July 10-12, 2017 ,Germany;30th International Conference on Microelectronics Test Structures, March 28-30, 2017, France; Tomsk IEEE Chapter & Student Branch of the Institute of Electrical and Electronics Engineers (IEEE), June 29–30, 2017, Kazakhstan; 3rd Global Optometrist Meeting and Trade Fair on Laser Technology, September 11-13, 2017, France; 19th International Conference on Electrical and Microelectronics Systems, March 9 - 10, 2017, USA; 19th International Conference on Microelectronics and Nano electronics, March 29 - 30, 2017, Singapore; 19th International Conference on Microelectronics, Nano electronics and Nano engineering, March 23-24, 2017, Czech Republic; The 2nd International Conference on Micro-electronics Engineering (ICME 2017), March 17-18, 2017, USA; International Conference on Laser Ablation, 3-8 September, 2017, France; ISPSD - The 29th International Symposium on Power Semiconductor Devices and ICs, May 28 - June 1, 2017, Japan; European Microelectronics and Packing Conference and Exhibition in Warsaw, September 10 - 13, 2017, Mazowieckie; CES - Consumer Electronics Show, Jan 5-8, 2017, USA; Radio Wireless Week, Jan 15-18, 2017, USA; INTERNEPCON JAPAN, Jan 18-20, 2017, Japan; SPIE Photonics West, Jan 28-Feb 2, 2017, USA; Design Con, Jan 31-Feb 2, 2017, USA; Pan Pacific Microelectronics, Feb 6-9, 2017, USA.

Track 4: GaAS (Gallium Arsenide) Technologies

GaAS is distinctive from silicon in numerous ways. First it can be made in the form of a very-high-resistivity semi-insulating substrate. This gives unique benefits for high-speed analog applications such as amps and receivers for communications and radar.

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Related Microelectronic Conferences of GaAS (Gallium Arsenide) Technologies

7th Euro Biosensors & Bioelectronics Conference, July 10-12, 2017,Germany; Medical Design & Manufacturing, Feb 7-9, 2017, USA; Semicon Korea, Feb 8-10, 2017, Korea; APEX IPC Expo, Feb 14-16, 2017, USA; Design & Manufacturing New England, Mar 3-4, 2017, USA; Del Mar Electronics Show, May 3-4, 2017, USA; IEEE Aerospace Conference, March 4-11, 2017, USA; BiTS - Burn-in & Test Socket Workshop, Mar 5-8, 2017, USA; IMAPS Device Packaging, Mar 6-9, 2017, USA; Satellite, Mar 6-9, 2017, USA; Smart Systems Integration, March 8-9, 2017, Germany; Embedded World, Mar 14-16, 2017, Germany; Semicon China, Mar 14-16, 2017, China; CPCA Show, Mar 14-16, 2017, China; CeBIT, Mar 20-24, 2017, Germany; GoMAC Tech, March 20-23, 2017, USA; Amper, Mar 21-24, 2017, Czech Republic; OFC - Optical Fiber Communications, Mar 21-23, 2017, USA; Microwave & RF, Mar 22-23, 2017, France; APEC Power Electronics, Mar 26-30, 2017, USA; DATE - Design Automation & Test, Mar 27-31, 2017, Switzerland. EMV, Mar 28-29, 2017, Germany; D2P Atlanta Design 2 Part, March 30-31, 2017, USA; FineTech FPD Mfgr Technology, Apr 5-7, 2017,Japan. Electronical Manufacturing Korea, Apr 5-7, 2017, Korea.

Track 5: Integrated circuit Manufacturing

The ultimate goal of Integrated circuit technologies is to be able to manufacture functional components at high volume and low cost. The amount of work required to complete a batch of wafers does not depend on the amount of information that the photomasks contain. One way to improve the manufacture of ICs is to increase the number of die per wafer by increasing the wafer size.

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Related Microelectronic Conferences of Integrated circuit Manufacturing

7th Euro Biosensors & Bioelectronics Conference , July 10-12, 2017 ,Germany;30th International Conference on Microelectronics Test Structures, March 28-30, 2017, France; Tomsk IEEE Chapter & Student Branch of the Institute of Electrical and Electronics Engineers (IEEE), June 29–30, 2017, Kazakhstan; 3rd Global Optometrist Meeting and Trade Fair on Laser Technology, September 11-13, 2017, France; 19th International Conference on Electrical and Microelectronics Systems, March 9 - 10, 2017, USA; 19th International Conference on Microelectronics and Nano electronics, March 29 - 30, 2017, Singapore; 19th International Conference on Microelectronics, Nano electronics and Nano engineering, March 23-24, 2017, Czech Republic; The 2nd International Conference on Micro-electronics Engineering (ICME 2017), March 17-18, 2017, USA; International Conference on Laser Ablation, 3-8 September, 2017, France; ISPSD - The 29th International Symposium on Power Semiconductor Devices and ICs, May 28 - June 1, 2017, Japan; European Microelectronics and Packing Conference and Exhibition in Warsaw, September 10 - 13, 2017, Mazowieckie; CES - Consumer Electronics Show, Jan 5-8, 2017, USA; Radio Wireless Week, Jan 15-18, 2017, USA; INTERNEPCON JAPAN, Jan 18-20, 2017, Japan; SPIE Photonics West, Jan 28-Feb 2, 2017, USA; Design Con, Jan 31-Feb 2, 2017, USA; Pan Pacific Microelectronics, Feb 6-9, 2017, USA.

Track 6: Micro/Nano electronics

Nano electronics denote to the use of nanotechnology in electronic components. The term covers a diverse set of devices and materials, with the shared characteristic that they are so small that inter-atomic interactions and quantum mechanical properties need to be studied widely. Recent silicon CMOS technology generations, such as the 22 nanometer node, are previously inside this regime. Nano electronics are occasionally considered as disruptive technology because current candidates are expressively changed from traditional transistors.

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7th Euro Biosensors & Bioelectronics Conference, July 10-12, 2017,Germany; Medical Design & Manufacturing, Feb 7-9, 2017, USA; Semicon Korea, Feb 8-10, 2017, Korea; APEX IPC Expo, Feb 14-16, 2017, USA; Design & Manufacturing New England, Mar 3-4, 2017, USA; Del Mar Electronics Show, May 3-4, 2017, USA; IEEE Aerospace Conference, March 4-11, 2017, USA; BiTS - Burn-in & Test Socket Workshop, Mar 5-8, 2017, USA; IMAPS Device Packaging, Mar 6-9, 2017, USA; Satellite, Mar 6-9, 2017, USA; Smart Systems Integration, March 8-9, 2017, Germany; Embedded World, Mar 14-16, 2017, Germany; Semicon China, Mar 14-16, 2017, China; CPCA Show, Mar 14-16, 2017, China; CeBIT, Mar 20-24, 2017, Germany; GoMAC Tech, March 20-23, 2017, USA; Amper, Mar 21-24, 2017, Czech Republic; OFC - Optical Fiber Communications, Mar 21-23, 2017, USA; Microwave & RF, Mar 22-23, 2017, France; APEC Power Electronics, Mar 26-30, 2017, USA; DATE - Design Automation & Test, Mar 27-31, 2017, Switzerland. EMV, Mar 28-29, 2017, Germany; D2P Atlanta Design 2 Part, March 30-31, 2017, USA; FineTech FPD Mfgr Technology, Apr 5-7, 2017,Japan. Electronical Manufacturing Korea, Apr 5-7, 2017, Korea.

Track 7: Signal processing

Signal processing is an enabling technology that involves the fundamental theory, applications, algorithms, and implementations of transmitting information contained in many different physical, symbolic, or abstract formats broadly designated as signals. Transducers convert signals from other physical waveforms to electric current or voltage waveforms, which are transmitted as electromagnetic waves, received and converted by another transducer to final form.

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7th Euro Biosensors & Bioelectronics Conference , July 10-12, 2017 ,Germany;30th International Conference on Microelectronics Test Structures, March 28-30, 2017, France; Tomsk IEEE Chapter & Student Branch of the Institute of Electrical and Electronics Engineers (IEEE), June 29–30, 2017, Kazakhstan; 3rd Global Optometrist Meeting and Trade Fair on Laser Technology, September 11-13, 2017, France; 19th International Conference on Electrical and Microelectronics Systems, March 9 - 10, 2017, USA; 19th International Conference on Microelectronics and Nano electronics, March 29 - 30, 2017, Singapore; 19th International Conference on Microelectronics, Nano electronics and Nano engineering, March 23-24, 2017, Czech Republic; The 2nd International Conference on Micro-electronics Engineering (ICME 2017), March 17-18, 2017, USA; International Conference on Laser Ablation, 3-8 September, 2017, France; ISPSD - The 29th International Symposium on Power Semiconductor Devices and ICs, May 28 - June 1, 2017, Japan; European Microelectronics and Packing Conference and Exhibition in Warsaw, September 10 - 13, 2017, Mazowieckie; CES - Consumer Electronics Show, Jan 5-8, 2017, USA; Radio Wireless Week, Jan 15-18, 2017, USA; INTERNEPCON JAPAN, Jan 18-20, 2017, Japan; SPIE Photonics West, Jan 28-Feb 2, 2017, USA; Design Con, Jan 31-Feb 2, 2017, USA; Pan Pacific Microelectronics, Feb 6-9, 2017, USA.

Track 8: Wireless Communication

Wireless communications is the fastest developing segment of the communications industry like it has captured the attention and imagination of the media and public. Cellular phones have experienced exponential growth over the last decade, and this growth continues unchanged worldwide, with more than a billion worldwide cell phone users projected in the near future. Certainly, cellular phones have become a critical business tool and part of everyday life in most established countries, and are rapidly supplanting antiquated wireline systems in many developing countries. And also, wireless local area networks are currently composed to increase or replace wired networks in many businesses and campuses.

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7th Euro Biosensors & Bioelectronics Conference, July 10-12, 2017,Germany; Medical Design & Manufacturing, Feb 7-9, 2017, USA; Semicon Korea, Feb 8-10, 2017, Korea; APEX IPC Expo, Feb 14-16, 2017, USA; Design & Manufacturing New England, Mar 3-4, 2017, USA; Del Mar Electronics Show, May 3-4, 2017, USA; IEEE Aerospace Conference, March 4-11, 2017, USA; BiTS - Burn-in & Test Socket Workshop, Mar 5-8, 2017, USA; IMAPS Device Packaging, Mar 6-9, 2017, USA; Satellite, Mar 6-9, 2017, USA; Smart Systems Integration, March 8-9, 2017, Germany; Embedded World, Mar 14-16, 2017, Germany; Semicon China, Mar 14-16, 2017, China; CPCA Show, Mar 14-16, 2017, China; CeBIT, Mar 20-24, 2017, Germany; GoMAC Tech, March 20-23, 2017, USA; Amper, Mar 21-24, 2017, Czech Republic; OFC - Optical Fiber Communications, Mar 21-23, 2017, USA; Microwave & RF, Mar 22-23, 2017, France; APEC Power Electronics, Mar 26-30, 2017, USA; DATE - Design Automation & Test, Mar 27-31, 2017, Switzerland. EMV, Mar 28-29, 2017, Germany; D2P Atlanta Design 2 Part, March 30-31, 2017, USA; FineTech FPD Mfgr Technology, Apr 5-7, 2017,Japan. Electronical Manufacturing Korea, Apr 5-7, 2017, Korea.

Track 9: Embedded Electronics Systems

An embedded system is a computer system with a out-and-out function within a larger mechanical system or electrical system. It is embedded as part of a whole device often including hardware and mechanical parts. An embedded system controls numerous devices for common use today. 98% of all microprocessors are manufactured as components of embedded systems.

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7th Euro Biosensors & Bioelectronics Conference , July 10-12, 2017 ,Germany;30th International Conference on Microelectronics Test Structures, March 28-30, 2017, France; Tomsk IEEE Chapter & Student Branch of the Institute of Electrical and Electronics Engineers (IEEE), June 29–30, 2017, Kazakhstan; 3rd Global Optometrist Meeting and Trade Fair on Laser Technology, September 11-13, 2017, France; 19th International Conference on Electrical and Microelectronics Systems, March 9 - 10, 2017, USA; 19th International Conference on Microelectronics and Nano electronics, March 29 - 30, 2017, Singapore; 19th International Conference on Microelectronics, Nano electronics and Nano engineering, March 23-24, 2017, Czech Republic; The 2nd International Conference on Micro-electronics Engineering (ICME 2017), March 17-18, 2017, USA; International Conference on Laser Ablation, 3-8 September, 2017, France; ISPSD - The 29th International Symposium on Power Semiconductor Devices and ICs, May 28 - June 1, 2017, Japan; European Microelectronics and Packing Conference and Exhibition in Warsaw, September 10 - 13, 2017, Mazowieckie; CES - Consumer Electronics Show, Jan 5-8, 2017, USA; Radio Wireless Week, Jan 15-18, 2017, USA; INTERNEPCON JAPAN, Jan 18-20, 2017, Japan; SPIE Photonics West, Jan 28-Feb 2, 2017, USA; Design Con, Jan 31-Feb 2, 2017, USA; Pan Pacific Microelectronics, Feb 6-9, 2017, USA.

Track 10: Digital image processing

Digital image processing deals with operation of digital images through a digital computer and also is a subfield of signals and systems but focuses mainly on images. DIP focuses on developing a computer system that is able to perform processing on an image and input of that system is a digital image and the system processess that image using efficient algorithms and provides an image as an output. The best common example is Adobe Photoshop. It is one of the widely used applications for processing digital images.

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7th Euro Biosensors & Bioelectronics Conference, July 10-12, 2017,Germany; Medical Design & Manufacturing, Feb 7-9, 2017, USA; Semicon Korea, Feb 8-10, 2017, Korea; APEX IPC Expo, Feb 14-16, 2017, USA; Design & Manufacturing New England, Mar 3-4, 2017, USA; Del Mar Electronics Show, May 3-4, 2017, USA; IEEE Aerospace Conference, March 4-11, 2017, USA; BiTS - Burn-in & Test Socket Workshop, Mar 5-8, 2017, USA; IMAPS Device Packaging, Mar 6-9, 2017, USA; Satellite, Mar 6-9, 2017, USA; Smart Systems Integration, March 8-9, 2017, Germany; Embedded World, Mar 14-16, 2017, Germany; Semicon China, Mar 14-16, 2017, China; CPCA Show, Mar 14-16, 2017, China; CeBIT, Mar 20-24, 2017, Germany; GoMAC Tech, March 20-23, 2017, USA; Amper, Mar 21-24, 2017, Czech Republic; OFC - Optical Fiber Communications, Mar 21-23, 2017, USA; Microwave & RF, Mar 22-23, 2017, France; APEC Power Electronics, Mar 26-30, 2017, USA; DATE - Design Automation & Test, Mar 27-31, 2017, Switzerland. EMV, Mar 28-29, 2017, Germany; D2P Atlanta Design 2 Part, March 30-31, 2017, USA; FineTech FPD Mfgr Technology, Apr 5-7, 2017,Japan. Electronical Manufacturing Korea, Apr 5-7, 2017, Korea.

About Conference

Conference series LLC cordially invites all participants across the globe to attend the International Conference on Microelectronics Engineering (Microelectronics 2017) which is going to be held during July 10-11 in Berlin, Germany to share the “Micro Electronics a macro way for Mega Avenues" and technology. The main theme of the conference is “Micro Electronics a macro way for Mega Avenues ". This conference aimed to expand its coverage in the areas of Microelectronics where expert talks, young researchers presentations will be placed in every session of the meeting will be inspired and keep up your enthusiasm. We feel our expert Organizing Committee is our major asset, however your presence over the venue will add one more feather to the crown of Microelectronics 2017.

The organizing committee is gearing up for an exciting and informative conference program including plenary lectures, symposia, workshops on a variety of topics, poster presentations and various programs for participants from all over the world. We invite you to join us at the Microelectronics 2017, where you will be sure to have a meaningful experience with scholars across the world. All members of the Microelectronics 2017 organizing committee look forward to meeting you in Berlin, Germany. Conference series LLC organizes a conference series of 1000+ Global Events inclusive of 300+ Conferences, 500+ Upcoming and Previous Symposiums and Workshops in USA, Europe & Asia with support from 1000 more scientific societies and publishes 700+ Open access journals which contains over 30000 eminent personalities, reputed scientists as editorial board members.

Microelectronics 2017 is comprised of the following sessions with 10 tracks and 50 sub sessions designed to offer comprehensive sessions that address current issues of  Microelectronics.

Target audience for the conference:                

  • Academicians
  • Directors/CEO.
  • Managers/Engineers.
  • Professors
  • Researchers from top universities
  • Scientists from top research institutes
  • Scholars
  • Electronics and Electrical Engineers
  • Design Engineers
  • Automotive Engineers
  • Nanotechnology Engineers
  • Telecommunication professionals
  • Manufacturer of electronics devices.
  • Industrial Professionals
  • Students

Why to attend

Microelectronics is the fastest growing and a leading branch of Electronics. Brilliant inventors and Researchers from the late 19th century to the present day have built on each other's work to launch a revolution in electronics. The achievements and accomplishments made in the fields of Electronics have transformed our way of living and has become an important part of our day to day life. Microelectronics 2017 will discuss the latest research outcomes and technological advancements in the field, bringing together leading, researchers, scholars, professors, engineers and students along with industrial professionals to exchange their views on critical aspects of Electronics research. The topics of the Microelectronics 2017 will be based on recent advancements and future technologies.

Microelectronics 2017 brings together eminent scientists, research scholar and industrial professional which will undoubtedly enrich our meeting.

Intended Audience

The report is especially intended for entrepreneurs, investors, venture capitalists, and other readers with a need to know where the microelectronics market is headed in the next 5 years. Other readers who should find the report particularly valuable include microelectronics marketing executives and government officials associated with the National Microelectronics Initiative and other state-level programs that promote the development of the microelectronics industry. The report’s findings and conclusions should also be of interest to the broader microelectronics community.

World-renowned speakers, the most recent techniques, tactics and the newest updates along with the Advances in the fields of Microelectronics

Come be Part of it...!

Market Analysis

Electronics has become the basic need of a human being in day to day life. According to a new market report the electronics market is estimated to grow at 10.5% (CAGR) from 2014 to 2020 and it is estimated to reach $40.2 billion by 2020.  The Electronics market has gained a remarkable increase in the demand of market at present. The advancements in technology due to the never ending R&D in this sector, makes it one of the prominent segments in the current industrial scenario. The electronics devices have been experiencing continuously developments right since their inception. Large companies such as Apple, LG Electronics US, and Samsung Electronics America offer products across a vast range of categories and are able to capitalize on brand recognition to enter new segments.

This research report analyzes this market depending on its market segments, major geographies, and current market trends. Geographies analyzed under this research report include

  • North America
  • Asia Pacific
  • Europe
  • Rest of the World 

This report provides comprehensive analysis of

  • Market growth drivers
  • Factors limiting market growth
  • Current market trends
  • Market structure
  • Market projections for upcoming years

This report is a complete study of current trends in the market, industry growth drivers, and restraints. It provides market projections for the coming years. It includes analysis of recent developments in technology, Porter’s five force model analysis and detailed profiles of top industry players. The report also includes a review of micro and macro factors essential for the existing market players and new entrants along with detailed value chain analysis.

 

To Collaborate Scientific Professionals around the World

Conference Date July 10-11,2017

Speaker Opportunity

Supported By

Journal of Electrical & Electronic Systems Journal of Biosensors & Bioelectronics Journal of Electrical Engineering and Electronic Technology

All accepted abstracts will be published in respective Conferenceseries International Journals.

Abstracts will be provided with Digital Object Identifier by