Sessions/Tracks
ConferenceSeries Ltd invites all the participants from all over the world to attend “International Conference on Microelectronics” during July 10 - 11, 2017 in Berlin, Germany which includes prompt keynote presentations, Oral talks, Poster presentations and Exhibitions
Track 1: Switching Transients in Devices and Circuits
Transformer switching is the most frequently performed operation in any power delivery system. Most of the times, this operation can be done without any undesirable consequences. However, given the right combination of system parameters, switching can result in a violent interaction between circuit breaker and transformer.
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7th Euro Biosensors & Bioelectronics Conference , July 10-12, 2017 ,Germany;30th International Conference on Microelectronics Test Structures, March 28-30, 2017, France; Tomsk IEEE Chapter & Student Branch of the Institute of Electrical and Electronics Engineers (IEEE), June 29–30, 2017, Kazakhstan; 3rd Global Optometrist Meeting and Trade Fair on Laser Technology, September 11-13, 2017, France; 19th International Conference on Electrical and Microelectronics Systems, March 9 - 10, 2017, USA; 19th International Conference on Microelectronics and Nano electronics, March 29 - 30, 2017, Singapore; 19th International Conference on Microelectronics, Nano electronics and Nano engineering, March 23-24, 2017, Czech Republic; The 2nd International Conference on Micro-electronics Engineering (ICME 2017), March 17-18, 2017, USA; International Conference on Laser Ablation, 3-8 September, 2017, France; ISPSD - The 29th International Symposium on Power Semiconductor Devices and ICs, May 28 - June 1, 2017, Japan; European Microelectronics and Packing Conference and Exhibition in Warsaw, September 10 - 13, 2017, Mazowieckie; CES - Consumer Electronics Show, Jan 5-8, 2017, USA; Radio Wireless Week, Jan 15-18, 2017, USA; INTERNEPCON JAPAN, Jan 18-20, 2017, Japan; SPIE Photonics West, Jan 28-Feb 2, 2017, USA; Design Con, Jan 31-Feb 2, 2017, USA; Pan Pacific Microelectronics, Feb 6-9, 2017, USA.
Track 2: CMOS(Complementary metal–oxide–semiconductor)Technologies
The technology used for making integrated circuits is CMOS (Complementary metal–oxide–semiconductor) and broadly used in Random Access Memory (RAM), microprocessors, microcontrollers and other digital logic circuits. This technology is also used for several analog circuits like data converters, image sensors(CMOS sensor) , and highly integrated transceivers for several types of communication and it is the first integrated circuits hitting the markets in the seventies had a few 100 transistors integrated in bipolar technology. Although the principles were well known, MOS arrived in the markets several years later and also it is one of the reason behind this was the inherent instability of the MOS transistors due to the existence of alkali elements in the gate dielectric and caused the threshold voltage of the transistor to shift during the operation.
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7th Euro Biosensors & Bioelectronics Conference, July 10-12, 2017,Germany; Medical Design & Manufacturing, Feb 7-9, 2017, USA; Semicon Korea, Feb 8-10, 2017, Korea; APEX IPC Expo, Feb 14-16, 2017, USA; Design & Manufacturing New England, Mar 3-4, 2017, USA; Del Mar Electronics Show, May 3-4, 2017, USA; IEEE Aerospace Conference, March 4-11, 2017, USA; BiTS - Burn-in & Test Socket Workshop, Mar 5-8, 2017, USA; IMAPS Device Packaging, Mar 6-9, 2017, USA; Satellite, Mar 6-9, 2017, USA; Smart Systems Integration, March 8-9, 2017, Germany; Embedded World, Mar 14-16, 2017, Germany; Semicon China, Mar 14-16, 2017, China; CPCA Show, Mar 14-16, 2017, China; CeBIT, Mar 20-24, 2017, Germany; GoMAC Tech, March 20-23, 2017, USA; Amper, Mar 21-24, 2017, Czech Republic; OFC - Optical Fiber Communications, Mar 21-23, 2017, USA; Microwave & RF, Mar 22-23, 2017, France; APEC Power Electronics, Mar 26-30, 2017, USA; DATE - Design Automation & Test, Mar 27-31, 2017, Switzerland. EMV, Mar 28-29, 2017, Germany; D2P Atlanta Design 2 Part, March 30-31, 2017, USA; FineTech FPD Mfgr Technology, Apr 5-7, 2017,Japan. Electronical Manufacturing Korea, Apr 5-7, 2017, Korea.
Track 3: Silicon Bipolar Technologies
A large number of innovations and developments were required to convert the original concept into an applied technology for fabricating VLSI circuits. Among these, diffusion was an significant first step, since it allowed thin bases and emitters to be fabricated by diffusing impurities from the vapour phase.
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7th Euro Biosensors & Bioelectronics Conference , July 10-12, 2017 ,Germany;30th International Conference on Microelectronics Test Structures, March 28-30, 2017, France; Tomsk IEEE Chapter & Student Branch of the Institute of Electrical and Electronics Engineers (IEEE), June 29–30, 2017, Kazakhstan; 3rd Global Optometrist Meeting and Trade Fair on Laser Technology, September 11-13, 2017, France; 19th International Conference on Electrical and Microelectronics Systems, March 9 - 10, 2017, USA; 19th International Conference on Microelectronics and Nano electronics, March 29 - 30, 2017, Singapore; 19th International Conference on Microelectronics, Nano electronics and Nano engineering, March 23-24, 2017, Czech Republic; The 2nd International Conference on Micro-electronics Engineering (ICME 2017), March 17-18, 2017, USA; International Conference on Laser Ablation, 3-8 September, 2017, France; ISPSD - The 29th International Symposium on Power Semiconductor Devices and ICs, May 28 - June 1, 2017, Japan; European Microelectronics and Packing Conference and Exhibition in Warsaw, September 10 - 13, 2017, Mazowieckie; CES - Consumer Electronics Show, Jan 5-8, 2017, USA; Radio Wireless Week, Jan 15-18, 2017, USA; INTERNEPCON JAPAN, Jan 18-20, 2017, Japan; SPIE Photonics West, Jan 28-Feb 2, 2017, USA; Design Con, Jan 31-Feb 2, 2017, USA; Pan Pacific Microelectronics, Feb 6-9, 2017, USA.
Track 4: GaAS (Gallium Arsenide) Technologies
GaAS is distinctive from silicon in numerous ways. First it can be made in the form of a very-high-resistivity semi-insulating substrate. This gives unique benefits for high-speed analog applications such as amps and receivers for communications and radar.
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7th Euro Biosensors & Bioelectronics Conference, July 10-12, 2017,Germany; Medical Design & Manufacturing, Feb 7-9, 2017, USA; Semicon Korea, Feb 8-10, 2017, Korea; APEX IPC Expo, Feb 14-16, 2017, USA; Design & Manufacturing New England, Mar 3-4, 2017, USA; Del Mar Electronics Show, May 3-4, 2017, USA; IEEE Aerospace Conference, March 4-11, 2017, USA; BiTS - Burn-in & Test Socket Workshop, Mar 5-8, 2017, USA; IMAPS Device Packaging, Mar 6-9, 2017, USA; Satellite, Mar 6-9, 2017, USA; Smart Systems Integration, March 8-9, 2017, Germany; Embedded World, Mar 14-16, 2017, Germany; Semicon China, Mar 14-16, 2017, China; CPCA Show, Mar 14-16, 2017, China; CeBIT, Mar 20-24, 2017, Germany; GoMAC Tech, March 20-23, 2017, USA; Amper, Mar 21-24, 2017, Czech Republic; OFC - Optical Fiber Communications, Mar 21-23, 2017, USA; Microwave & RF, Mar 22-23, 2017, France; APEC Power Electronics, Mar 26-30, 2017, USA; DATE - Design Automation & Test, Mar 27-31, 2017, Switzerland. EMV, Mar 28-29, 2017, Germany; D2P Atlanta Design 2 Part, March 30-31, 2017, USA; FineTech FPD Mfgr Technology, Apr 5-7, 2017,Japan. Electronical Manufacturing Korea, Apr 5-7, 2017, Korea.
Track 5: Integrated circuit Manufacturing
The ultimate goal of Integrated circuit technologies is to be able to manufacture functional components at high volume and low cost. The amount of work required to complete a batch of wafers does not depend on the amount of information that the photomasks contain. One way to improve the manufacture of ICs is to increase the number of die per wafer by increasing the wafer size.
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7th Euro Biosensors & Bioelectronics Conference , July 10-12, 2017 ,Germany;30th International Conference on Microelectronics Test Structures, March 28-30, 2017, France; Tomsk IEEE Chapter & Student Branch of the Institute of Electrical and Electronics Engineers (IEEE), June 29–30, 2017, Kazakhstan; 3rd Global Optometrist Meeting and Trade Fair on Laser Technology, September 11-13, 2017, France; 19th International Conference on Electrical and Microelectronics Systems, March 9 - 10, 2017, USA; 19th International Conference on Microelectronics and Nano electronics, March 29 - 30, 2017, Singapore; 19th International Conference on Microelectronics, Nano electronics and Nano engineering, March 23-24, 2017, Czech Republic; The 2nd International Conference on Micro-electronics Engineering (ICME 2017), March 17-18, 2017, USA; International Conference on Laser Ablation, 3-8 September, 2017, France; ISPSD - The 29th International Symposium on Power Semiconductor Devices and ICs, May 28 - June 1, 2017, Japan; European Microelectronics and Packing Conference and Exhibition in Warsaw, September 10 - 13, 2017, Mazowieckie; CES - Consumer Electronics Show, Jan 5-8, 2017, USA; Radio Wireless Week, Jan 15-18, 2017, USA; INTERNEPCON JAPAN, Jan 18-20, 2017, Japan; SPIE Photonics West, Jan 28-Feb 2, 2017, USA; Design Con, Jan 31-Feb 2, 2017, USA; Pan Pacific Microelectronics, Feb 6-9, 2017, USA.
Track 6: Micro/Nano electronics
Nano electronics denote to the use of nanotechnology in electronic components. The term covers a diverse set of devices and materials, with the shared characteristic that they are so small that inter-atomic interactions and quantum mechanical properties need to be studied widely. Recent silicon CMOS technology generations, such as the 22 nanometer node, are previously inside this regime. Nano electronics are occasionally considered as disruptive technology because current candidates are expressively changed from traditional transistors.
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7th Euro Biosensors & Bioelectronics Conference, July 10-12, 2017,Germany; Medical Design & Manufacturing, Feb 7-9, 2017, USA; Semicon Korea, Feb 8-10, 2017, Korea; APEX IPC Expo, Feb 14-16, 2017, USA; Design & Manufacturing New England, Mar 3-4, 2017, USA; Del Mar Electronics Show, May 3-4, 2017, USA; IEEE Aerospace Conference, March 4-11, 2017, USA; BiTS - Burn-in & Test Socket Workshop, Mar 5-8, 2017, USA; IMAPS Device Packaging, Mar 6-9, 2017, USA; Satellite, Mar 6-9, 2017, USA; Smart Systems Integration, March 8-9, 2017, Germany; Embedded World, Mar 14-16, 2017, Germany; Semicon China, Mar 14-16, 2017, China; CPCA Show, Mar 14-16, 2017, China; CeBIT, Mar 20-24, 2017, Germany; GoMAC Tech, March 20-23, 2017, USA; Amper, Mar 21-24, 2017, Czech Republic; OFC - Optical Fiber Communications, Mar 21-23, 2017, USA; Microwave & RF, Mar 22-23, 2017, France; APEC Power Electronics, Mar 26-30, 2017, USA; DATE - Design Automation & Test, Mar 27-31, 2017, Switzerland. EMV, Mar 28-29, 2017, Germany; D2P Atlanta Design 2 Part, March 30-31, 2017, USA; FineTech FPD Mfgr Technology, Apr 5-7, 2017,Japan. Electronical Manufacturing Korea, Apr 5-7, 2017, Korea.
Track 7: Signal processing
Signal processing is an enabling technology that involves the fundamental theory, applications, algorithms, and implementations of transmitting information contained in many different physical, symbolic, or abstract formats broadly designated as signals. Transducers convert signals from other physical waveforms to electric current or voltage waveforms, which are transmitted as electromagnetic waves, received and converted by another transducer to final form.
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7th Euro Biosensors & Bioelectronics Conference , July 10-12, 2017 ,Germany;30th International Conference on Microelectronics Test Structures, March 28-30, 2017, France; Tomsk IEEE Chapter & Student Branch of the Institute of Electrical and Electronics Engineers (IEEE), June 29–30, 2017, Kazakhstan; 3rd Global Optometrist Meeting and Trade Fair on Laser Technology, September 11-13, 2017, France; 19th International Conference on Electrical and Microelectronics Systems, March 9 - 10, 2017, USA; 19th International Conference on Microelectronics and Nano electronics, March 29 - 30, 2017, Singapore; 19th International Conference on Microelectronics, Nano electronics and Nano engineering, March 23-24, 2017, Czech Republic; The 2nd International Conference on Micro-electronics Engineering (ICME 2017), March 17-18, 2017, USA; International Conference on Laser Ablation, 3-8 September, 2017, France; ISPSD - The 29th International Symposium on Power Semiconductor Devices and ICs, May 28 - June 1, 2017, Japan; European Microelectronics and Packing Conference and Exhibition in Warsaw, September 10 - 13, 2017, Mazowieckie; CES - Consumer Electronics Show, Jan 5-8, 2017, USA; Radio Wireless Week, Jan 15-18, 2017, USA; INTERNEPCON JAPAN, Jan 18-20, 2017, Japan; SPIE Photonics West, Jan 28-Feb 2, 2017, USA; Design Con, Jan 31-Feb 2, 2017, USA; Pan Pacific Microelectronics, Feb 6-9, 2017, USA.
Track 8: Wireless Communication
Wireless communications is the fastest developing segment of the communications industry like it has captured the attention and imagination of the media and public. Cellular phones have experienced exponential growth over the last decade, and this growth continues unchanged worldwide, with more than a billion worldwide cell phone users projected in the near future. Certainly, cellular phones have become a critical business tool and part of everyday life in most established countries, and are rapidly supplanting antiquated wireline systems in many developing countries. And also, wireless local area networks are currently composed to increase or replace wired networks in many businesses and campuses.
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7th Euro Biosensors & Bioelectronics Conference, July 10-12, 2017,Germany; Medical Design & Manufacturing, Feb 7-9, 2017, USA; Semicon Korea, Feb 8-10, 2017, Korea; APEX IPC Expo, Feb 14-16, 2017, USA; Design & Manufacturing New England, Mar 3-4, 2017, USA; Del Mar Electronics Show, May 3-4, 2017, USA; IEEE Aerospace Conference, March 4-11, 2017, USA; BiTS - Burn-in & Test Socket Workshop, Mar 5-8, 2017, USA; IMAPS Device Packaging, Mar 6-9, 2017, USA; Satellite, Mar 6-9, 2017, USA; Smart Systems Integration, March 8-9, 2017, Germany; Embedded World, Mar 14-16, 2017, Germany; Semicon China, Mar 14-16, 2017, China; CPCA Show, Mar 14-16, 2017, China; CeBIT, Mar 20-24, 2017, Germany; GoMAC Tech, March 20-23, 2017, USA; Amper, Mar 21-24, 2017, Czech Republic; OFC - Optical Fiber Communications, Mar 21-23, 2017, USA; Microwave & RF, Mar 22-23, 2017, France; APEC Power Electronics, Mar 26-30, 2017, USA; DATE - Design Automation & Test, Mar 27-31, 2017, Switzerland. EMV, Mar 28-29, 2017, Germany; D2P Atlanta Design 2 Part, March 30-31, 2017, USA; FineTech FPD Mfgr Technology, Apr 5-7, 2017,Japan. Electronical Manufacturing Korea, Apr 5-7, 2017, Korea.
Track 9: Embedded Electronics Systems
An embedded system is a computer system with a out-and-out function within a larger mechanical system or electrical system. It is embedded as part of a whole device often including hardware and mechanical parts. An embedded system controls numerous devices for common use today. 98% of all microprocessors are manufactured as components of embedded systems.
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7th Euro Biosensors & Bioelectronics Conference , July 10-12, 2017 ,Germany;30th International Conference on Microelectronics Test Structures, March 28-30, 2017, France; Tomsk IEEE Chapter & Student Branch of the Institute of Electrical and Electronics Engineers (IEEE), June 29–30, 2017, Kazakhstan; 3rd Global Optometrist Meeting and Trade Fair on Laser Technology, September 11-13, 2017, France; 19th International Conference on Electrical and Microelectronics Systems, March 9 - 10, 2017, USA; 19th International Conference on Microelectronics and Nano electronics, March 29 - 30, 2017, Singapore; 19th International Conference on Microelectronics, Nano electronics and Nano engineering, March 23-24, 2017, Czech Republic; The 2nd International Conference on Micro-electronics Engineering (ICME 2017), March 17-18, 2017, USA; International Conference on Laser Ablation, 3-8 September, 2017, France; ISPSD - The 29th International Symposium on Power Semiconductor Devices and ICs, May 28 - June 1, 2017, Japan; European Microelectronics and Packing Conference and Exhibition in Warsaw, September 10 - 13, 2017, Mazowieckie; CES - Consumer Electronics Show, Jan 5-8, 2017, USA; Radio Wireless Week, Jan 15-18, 2017, USA; INTERNEPCON JAPAN, Jan 18-20, 2017, Japan; SPIE Photonics West, Jan 28-Feb 2, 2017, USA; Design Con, Jan 31-Feb 2, 2017, USA; Pan Pacific Microelectronics, Feb 6-9, 2017, USA.
Track 10: Digital image processing
Digital image processing deals with operation of digital images through a digital computer and also is a subfield of signals and systems but focuses mainly on images. DIP focuses on developing a computer system that is able to perform processing on an image and input of that system is a digital image and the system processess that image using efficient algorithms and provides an image as an output. The best common example is Adobe Photoshop. It is one of the widely used applications for processing digital images.
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